- Email: info@sz-guanke.com
- Whatsapp: 8613812671603
Vision: 15MP color camera, image processing ＜6.5ms
Inspection: Supports 01005 components & 0.3mm pitch solder joints
PCB: 50×50~510×485mm
Stage: Positioning ＜10μm, travel speed 700mm/s
Defect Detection: Covers missing parts, solder bridging and more
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Item |
Technical specifications |
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Visual technology |
15 million pixel color camera with optional resolution of 20/15/10 microns, FOV of 40.96 mm × 40.96 mm, and 0201 component image processing speed of ＜6.5 ms |
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Test capability |
Able to test 01005 components and 0.3mm spaced solder joints, covering various defects such as missing parts and solder bridging |
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PCB adaptation |
Size: 50×50 mm ~ 510×485 mm, thickness: 0.5~3.0 mm, warpage: ＜2 mm |
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Positioning accuracy |
X/Y platform positioning accuracy: ＜10 μ m, moving speed: 700 mm/s, track height: 900 ± 20 mm |
